COVID-19 Update • 11/20/2021
UB graduate research assistant Saurabh Khuje (left) and postdoctoral researcher Dr. Aaron Sheng gave an example of a flexible hybrid electronic device printed with copper ink materials. Image source: University of Buffalo.
Buffalo, New York — A research team led by the University of Buffalo will study how to make a new generation of high-temperature sensor electronics that can bend and adapt to different shapes.
This work in collaboration with Binghamton University, Buffalo-based contract manufacturer Tapecon, Inc., and Corning Incorporated was achieved through a $650,000 grant.
These funds were awarded by NextFlex, a flexible hybrid electronics manufacturing innovation institute supported by the Department of Defense, which is composed of American electronics companies, academic institutions, non-profit organizations, and government partners to promote the manufacturing of printed flexible electronic products in the United States.
The project will focus on the development of high-temperature flexible hybrid electronic devices, which, according to NextFlex, "combine the flexibility and low cost of printed plastic film substrates with the performance of semiconductor devices." The goal is to "create a new category of electronic products" whose substrates are "stretchable, fit and flexible"
The goal of the research team is to develop copper-based conductive ink materials that can run on flexible Corning carbon ribbon ceramic substrates at temperatures of 1,000 degrees Celsius or higher. Researchers will also work on designing manufacturing processes to reduce the time and money required to manufacture such materials.
The project’s lead researcher Ren Shenqiang said that the development of these materials is essential for the modernization of hypersonic weapon systems with flexible hybrid electronic equipment. These materials are also expected to play a key role in updating other technologies, including high-temperature conformal antennas, sensors, and power electronics.
"To make advanced materials, you need printable copper and flexible ceramics," said Ren, who works at the Institute of Mechanical and Aerospace Engineering, Chemistry, and UB RENEW. "The development of advanced materials and related manufacturing processes will also lead to new applications in the fields of medical equipment, aerospace industry, and robotics."
Rafael Tudela, Flexible Hybrid Electronics Engineer and Co-Principal Investigator of Tapecon, said: "This revolutionary technology will not only provide higher performance in the field of flexible hybrid electronics, but will also move forward in making electronic products more sustainable. Take a step forward." "We will be able to manufacture copper traces with additive materials instead of traditional subtractive manufacturing. This will allow us to eliminate waste and harmful chemicals."
Other researchers include Co-Principal Researcher Mark Poliks, Binghamton University Imperial Innovation Engineering Professor; Tapecon President Steve Davis; UB Mechanical and Aerospace Engineering Research Associate Professor Jason Armstrong; and UB Industrial and Systems Engineering Associate Professor Chi Zhou.
Cory Nealon Computer Science News Content Engineering Director Tel: 716-645-4614 cmnealon@buffalo.edu Twitter: @UBengineering
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